Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip

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Persistent URL	http://purl.org/net/epubs/work/58859467
Record Status	Checked
Record Id	58859467
Title	Single Die Process Using Shadow Masks for a 55µm Fine Pitch Array of 4µm-Tall Indium Bumps Across an Entire Chip
Contributors	A Schneider (STFC Rutherford Appleton Lab.), A Koorikkat (STFC Rutherford Appleton Lab.), D Burt, N Ghorbanian (STFC Rutherford Appleton Lab.), TG Brookes (STFC Rutherford Appleton Lab.), JD Lipp (STFC Rutherford Appleton Lab.), MJ French (STFC Rutherford Appleton Lab.)
Abstract
Organisation	TECH , STFC
Keywords
Funding Information
Related Research Object(s):	58859283
Licence Information:	Creative Commons Attribution 4.0 International (CC BY 4.0)
Language	English (EN)

Type	Details	URI(s)	Local file(s)	Year
Author Accepted Manuscript	2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (2024).		STFC-AAM-2024-015.pdf	2024