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Persistent URL	http://purl.org/net/epubs/work/46604888
Record Status	Checked
Record Id	46604888
Title	Stencil Printing and Flip -Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB -type Interposer and Flexible Printed Circuit Boards
Contributors	A Schneider (STFC Rutherford Appleton Lab.), SP Cross (STFC Rutherford Appleton Lab.), MD Wilson (STFC Rutherford Appleton Lab.), MC Veale (STFC Rutherford Appleton Lab.), M Hart (STFC Rutherford Appleton Lab.), P Seller (STFC Rutherford Appleton Lab.), M Borri (STFC Daresbury Lab.), D Beckett (STFC Rutherford Appleton Lab.), JD Lipp (STFC Rutherford Appleton Lab.)
Abstract
Organisation	TECH , STFC
Keywords
Funding Information
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Language	English (EN)

Type	Details	URI(s)	Local file(s)	Year
Paper In Conference Proceedings	In 22nd European Microelectronics and Packaging Conference and Exhibition (EMPC), Pisa, ITALY, 16-19 Sept 2019, European Microelectronics Packaging Conference (2019).			2019