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Persistent URL http://purl.org/net/epubs/work/46604888
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Record Id 46604888
Title Stencil Printing and Flip -Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB -type Interposer and Flexible Printed Circuit Boards
Organisation TECH , STFC
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Language English (EN)
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Paper In Conference Proceedings In 22nd European Microelectronics and Packaging Conference and Exhibition (EMPC), Pisa, ITALY, 16-19 Sep 2019, European Microelectronics Packaging Conference (2019). 2019