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Persistent URL http://purl.org/net/epubs/work/54098801
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Record Id 54098801
Title Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
Contributors
Abstract
Organisation ISIS , ISIS-GEN , STFC
Keywords
Funding Information STMicroelectronics (JPT.S (BPKI)2000/016/018/019(29))
Related Research Object(s):
Licence Information: Creative Commons Attribution 4.0 International (CC BY 4.0)
Language English (EN)
Type Details URI(s) Local file(s) Year
Journal Article Materials 15, no. 4 (2022): 1451. doi:10.3390/ma15041451 2022