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Persistent URL	http://purl.org/net/epubs/work/63470828
Record Status	Checked
Record Id	63470828
Title	Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding
Contributors	A Schneider (STFC Rutherford Appleton Lab.), A Koorikkat (STFC Rutherford Appleton Lab.), P Ariyathilaka (STFC Rutherford Appleton Lab.), N Acharya (STFC Rutherford Appleton Lab.), K Ratter (STFC Rutherford Appleton Lab.), V Chidambaram (STFC Rutherford Appleton Lab.), JD Lipp (STFC Rutherford Appleton Lab.), EE Reynolds (STFC Rutherford Appleton Lab.), MJ French (STFC Rutherford Appleton Lab.)
Abstract
Organisation	CLF , TECH , STFC , NQCC
Keywords
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Language	English (EN)

Type	Details	URI(s)	Local file(s)	Year
Paper In Conference Proceedings	In 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Grenoble, France, 15-18 Sept 2025, (2025): 1-5.	doi:10.23919/EMPC63132.2025.11222448		2025